Siemens Sinumerik CYCLE83 Deep-Hole Peck Drilling Cycle

Siemens Sinumerik CYCLE83 Peck drilling cycle makes deep hole drilling easy, Very flexible drilling cycle gives cnc machinists full control over all aspects of deep hole drilling tasks.

CNC machinists can control whether they want to retract tool every time to start-point for chip-removal or they can set for just chip-breaking, this way tool will just retract 1 mm for next peck.

Siemens Sinumerik CYCLE83 Deep-Hole Drilling

The tool drills at the programmed spindle speed and feedrate to the entered final drilling depth.
Deep hole drilling is performed with a depth infeed of a maximum definable depth executed several times, increasing gradually until the final drilling depth is reached.

Siemens Sinumerik CYCLE83 Deep-Hole Drilling Cycle Format

CYCLE83(RTP, RFP, SDIS, DP, DPR, FDEP, FDPR, DAM, DTB, DTS, FRF, VARI)
Siemens Sinumerik CYCLE83 Deep-Hole Peck Drilling Cycle - Swarf removal

Siemens Sinumerik CYCLE83 Deep-Hole Peck Drilling Cycle – Swarf removal

RTP     Retraction plane (absolute)
RFP     Reference plane (absolute)
SDIS    Safety clearance (enter without sign)
DP       Final drilling depth (absolute)
DPR     Final drilling depth relative to the reference plane (enter without sign)
FDEP   First drilling depth (absolute)
FDPR   First drilling depth relative to the reference plane (enter without sign)
DAM     Amount of degression (enter without sign)
DTB     Dwell time at final drilling depth (chip breaking)
DTS     Dwell time at starting point and for swarf removal
FRF     Feedrate factor for the first drilling depth (enter without sign) Range of values: 0.001 … 1
VARI    Machining type (Chip breaking=0, Swarf removal=1)

Drill Retraction

Parameter VARI – Machining type
Chip breaking=0 (see figure below)
Swarf removal=1 (see above figure)

Siemens Sinumerik CYCLE83 Deep-Hole Peck Drilling Cycle - Chip breaking

Siemens Sinumerik CYCLE83 Deep-Hole Peck Drilling Cycle – Chip breaking

The drill can either be retracted to the reference plane + safety clearance after every infeed depth for swarf removal or retracted in each case by 1 mm for chip breaking.